Advanced Packaging: Introduction to Polymers

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WEEK 1 – INTRO TO POLYMERS USED IN ADVANCED PACKAGING
• This course provides a comprehensive introduction to advanced packaging, exploring various package types and emerging trends in packaging architecture. We emphasize high-density interconnect (HDI) laminates and substrates, build-up film technologies, and innovative laminate materials engineered for 5G mobile applications.
• An overview of 3D or heterogeneous integration.
• Overview of polymers used in electronic packaging, explaining the rationale behind
selecting specific chemistries and key properties, as well as the measurement of polymer properties such as the glass transition temperature, coefficient of thermal expansion, modulus, and rheological properties.
• Structure, property, and process performance relationships in various package types. The presentation of the types of material interactions leads to package reliability and reliability testing.

WEEK 2 – HIGH-DENSITY PACKAGING APPLICATIONS ENABLED BY ADVANCED POLYMERIC MATERIALS
• High-density interconnect (HDI) materials and process. Types of HDI structures, polymer material properties, and the manufacturing process used to fabricate HDI laminates, with a focus on the key polymer-related processes such as lamination, laser drilling, and lead-free reflow reliability.
• Build up films (chemistry, process, properties). Detailed description of the chemistry, processing, and testing of build-up film laminates. An extensive discussion of Ajinomoto build-up films and other types of build-up films.
• Low dielectric constant and low dielectric loss materials and applications, such as antenna in package (AIP). Present the emerging packing structures, materials used, chemistry impact on the dielectric loss factor, and performance in packaging.
• Overview of leading-edge advanced packaging architectures such as underfills, fanout panel level packaging (advanced package built on a PCB-like substrate with modified PCB processing), and heterogeneous integration, and how HDI and buildup films play a role in future packages.