Master Electronics Manufacturing with Engineering Pro

Engineers make decisions every day that impact manufacturing. Make sure it's a positive impact by introducing the key concepts, tools, materials, and processes critical for engineers to succeed in electronics assembly.

Identify the most common IPC standards used by electronics manufacturers, explain product classes and acceptability conditions as outlined in IPC standards, utilize IPC standards to precisely locate specific acceptance criteria, and use figures, illustrations, tables, and units of measurement to assess compliance.

You’ll use IPC-A-610 to align quality expectations, reduce rework, satisfy customer requirements, and support reliable, high-quality production.

You’ll use J-STD-001 to make sound process decisions, align quality expectations across teams, reduce rework, and support consistent, high-reliability outcomes.

Este curso iniciará a participantes a las causas de las Descargas Electrostáticas (ESD, por sus siglas en inglés) y los pasos que puede tomar para mitigar sus efectos al manejar, almacenar, o transportar componentes sensitivos a ESD en una planta de fabricación. Estas medidas preventivas y su aplicación están basadas en ANSI/ESD S20.20 y otros estándares relevantes.

Este curso presenta a los participantes las causas de los FOD y las medidas que se pueden adoptar para mitigar sus efectos a la hora de manipular, almacenar y transportar elementos en una instalación de fabricación.

In electronics manufacturing, chemicals are everywhere, from cleaning agents to conformal coatings, and mishandling them can risk health, safety, and production. This course equips engineers with the skills to read, interpret, and apply Safety Data Sheets (SDS) to make informed decisions that keep people safe and processes compliant.

Este curso introduce los riesgos laborales y mejores prácticas de seguridad en el ámbito de la industria electrónica. Después de completar este curso, los participantes podran emplear las herramientas, materiales y procesos claves para garantizar su seguridad y las de sus compañeros de trabajo en una planta de fabricación.

In this course, participants will learn how to identify and determine the value of the most common electronic components used in PCB assembly, as well as how to use component markings and assembly documentation to ensure their correct orientation and placement.

This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.

Onboarding manufacturing engineers new to the electronics industry can be a daunting task. What if you had a self-paced course that provides a comprehensive overview of the roles and responsibilities of manufacturing engineers in our industry? IPC worked with industry subject-matter experts and instructional designers to create an introductory course that takes approximately 3-1/2 hours to complete. In addition to understanding the role, participants will also learn to use documentation control systems, product identification, and product traceability.

In this course, you will be able to set up, monitor, and maintain wave and selective soldering equipment to support consistent, high-quality production. You will know how to apply process parameters, interpret profile data, select the right nozzles and solder pot configuration, and implement maintenance procedures that reduce variation, prevent common defects, and keep your line running efficiently.

This course provides a comprehensive overview of the surface mount assembly process including information on component considerations, selecting and setting up pick and place machines, and the reflow process. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.

A comprehensive overview of the stencil printing process for a manufacturing engineer. Participants will learn how to select and store solder pastes & adhesives. They will also learn how to create and maintain stencils, the function of the stencil printer, as well as how to set up the stencil printer for a new product introduction, or NPI, run.

This course provides a comprehensive overview of component preparation, tool selection, manual component insertion, and automated component insertion in electronics assembly with through-hole components. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.  

Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.

A comprehensive overview of process control methodology including how to utilize the IPC-J-STD-001 Standard and its associated Handbook to consistently conform to acceptance criteria throughout the assembly process.

In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality. After completing this course, you will be able to: Identify and correct control processes that negatively affect circuit board quality Establish the root cause of potential defects to minimize and prevent loss of quality Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes

Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.

A comprehensive overview of process control methodology including how to utilize the IPC-J-STD-001 Standard and its associated Handbook to consistently conform to acceptance criteria throughout the assembly process.