Introduction to IPC-A-610: Acceptability of Electronic Assemblies

Download the Syllabus

Learning Objectives Per Course Module

Module 1: Introduction to IPC-A-610
• Describe the purpose and importance of IPC-A-610 in electronics manufacturing
• Explain how IPC-A-610 is developed and revised in collaboration with industry stakeholders and standards organizations
• Explain how IPC-A-610 ensures compliance with contractual requirements
Module 2: Product Classification and Applicable Documents
• Identify the three IPC product classes
• Compare acceptance criteria across product classes
• Evaluate how product classification impacts manufacturing decisions
• Use evaluation results to make cost-effective resource and process decisions
• Explain the role of the key industry standards referenced in IPC-A-610
Module 3: Handling and Storage Requirements
• Identify best practices for handling assemblies to prevent damage
• Explain the importance of contamination prevention
• Recognize common contamination sources
• Define the risks of electrostatic discharge (ESD)
• Identify sources of static electricity
• Describe ESD protection measures for safeguarding sensitive components
• Explain the dangers of moisture damage to moisture-sensitive components
• Describe methods for preventing moisture damage
Module 4: Soldering Process and Workmanship Requirements
• Recognize the characteristics of an acceptable solder connection as per IPC-A-610
• Identify common soldering defects as outlined in IPC-A-610 and describe their causes
• Explain the requirements and potential problems posed by high-voltage solder connections
Module 5: Component and Terminal Connections
• Identify the basic requirements for preparing, securing, and soldering wires to terminals
• Use common visual indicators to distinguish between acceptable and nonconforming wire terminations
• Describe how proper wire routing and support help reduce stress on soldered connections
• Explain how jumper wires are routed, secured, and soldered to ensure proper installation in electronic assemblies
Module 6: Through-hole Technology
• Recognize common through-hole mounting methods
• Identify methods used to support and stabilize through-hole components before soldering
• Explain why proper lead protrusion is important for solder strength and mechanical stability
• Describe the minimum and maximum requirements for lead protrusion
• Recognize common causes of incorrect lead length
• Describe the factors that determine through-hole solder fillet acceptability
• Identify common through-hole soldering defects and their causes
Module 7: Surface Mount Technology
• Recognize common surface mount components (SMT) and types of SMT terminations
• Define IPC-A-610’s acceptability criteria for surface mount connections
• Identify common surface mount soldering defects and describe their causes
Module 8: Component Damage
• Define component damage and its impact on reliability
• Explain how damage typically occurs in electronics manufacturing
• Describe IPC-A-610’s role in assessing component damage
Module 9: Printed Board Requirements
• Identify common types of laminate, board surface, conductor, and land damage, and their causes
• Explain why certain board defects can affect the long-term reliability of an assembly
• Recognize damage or contamination to solder mask, conformal coating, cleanliness, and markings
• Recognize visual defects for non-soldered contact areas
• Identify the causes of defects in non-soldered contact areas

Final Exam
Participants must complete the Final Exam with a passing score of 80% to access and download their Introduction to IPC-A-610 Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that participants must wait 24 hours after completing their second attempt to commence their third and final attempt.

This course is ideal for anyone involved in electronics manufacturing or quality assurance—operators, technicians, inspectors, engineers, and supervisors—who needs a solid understanding of IPC-A-610. No prior experience with the standard is required; if you handle, assemble, inspect, or manage the production of electronic assemblies, you’ll learn to speak the same “acceptability” language, make objective workmanship judgments, and contribute to safer, more reliable products.

Global Electronics Association offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online self-paced: Participants can access course materials on the Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines and monitor the progress of the participants who register for a course.