Introduction to J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies

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Learning Objectives Per Course Module

Module 1: Scope and Purpose of J-STD-001
• Define the scope and purpose of J-STD-001
• Identify and Understand the role of J-STD-001 in electronics manufacturing
Module 2: Product Classification and Applicable Documents
• Identify the three IPC product classes and the types of products they represent
• Compare the differences in acceptance criteria for each class
• Examine how classification impacts product reliability and performance
• Review four of the most referenced standards and understand their roles in electronic assembly
Module 3: Materials, Components, Tools, and Equipment
• Describe the role of material selection and process compliance in achieving reliable soldered assemblies
• Explain how material choices influence product performance, durability, and long-term reliability
• Identify key material requirements in J-STD-001, including compatibility, usage, and documentation
• Apply J-STD-001 guidelines to select, handle, and inspect electronic components
• Apply J-STD-001 guidelines to select, use, and maintain tools and equipment
Module 4: Soldering Process Requirements
• Identify the primary soldering methods used in electronics manufacturing, including hand soldering, wave soldering, and reflow soldering
• Recognize the role of J-STD-001 in various soldering methods, including hand soldering, wave soldering, and reflow soldering
• Describe the factors that influence solderability, such as surface cleanliness, preparation techniques, and material properties
• Explain how proper storage, handling, and cleaning practices help maintain solderability and ensure reliable solder connections
• Summarize the purpose of the general soldering requirements in J-STD-001 and their relevance to various roles and processes
• Identify common soldering defects and explain the conditions that cause them
• Describe how soldering defects can affect connection integrity, product performance, and long-term reliability
Module 5: Wire and Terminal Connections
• Describe best practices for wire preparation, including insulation removal, mechanical 
attachment, and wire routing
• Explain the importance of proper wire and insulation placement, clearance, and stress relief in terminal connections
• Identify acceptable solder connections 
• Recognize common soldering defects and their root causes
• Explain the risks of thermal damage during soldering and describe techniques for proper heat management
• Explain common causes and effects of wire-terminal connection failures, including mechanical and electrical failures
• Explain the responsibilities of key roles and how cross-functional collaboration supports compliance with J-STD-001
Module 6: Through-hole Technology
• Compare manual and automated component insertion methods and describe their typical use cases
• Explain the importance of proper component orientation and lead alignment in through-hole assembly
• Identify common lead types and match them to their appropriate applications
• Define lead protrusion and explain its importance in ensuring reliable solder connections
• Differentiate between supported and unsupported holes and explain how each affects connection reliability
• Distinguish between acceptable and nonconforming solder connections
• Identify common through-hole soldering defects and explain their underlying causes
Module 7: Surface Mount Technology
• Identify common termination types used in surface mount components
• Describe the key features of an acceptable surface mount solder connection 
• Explain the challenges posed by fine pitch and bottom-terminated components 
Module 8: Cleaning and Contamination Control 
• Explain the critical role of cleaning and contamination control in electronics manufacturing
• Recognize the importance of identifying, preventing, and controlling foreign object debris 
• Identify common types of residues and their typical sources in the assembly process
• Identify key industry standards and their roles in guiding cleaning processes, residue acceptability, and contamination control 
Module 9: Printed Board Requirements
• Identify common types of laminate damage, their causes, and how they occur during manufacturing and handling
• Describe the causes and consequences of damage to PCB lands
• Recognize various forms of conductor damage and explain how they affect electrical performance and reliability
• Identify different types of non-soldered contact damage
• Explain the causes of defects in non-soldered contact areas
Module 10: Protective Finishes and Witness Stripes
• Identify the primary functions of adhesives in electronic assemblies, and describe basic safety considerations
• Explain the roles of conformal coating, encapsulation, staking, and witness stripes in protecting and reinforcing assemblies
• Identify common issues that can occur when applying conformal coatings, encapsulants, staking compounds, and witness stripes
• Describe basic preventive measures that help ensure proper application and effective protection of these materials
Module 11: Rework and Repair
• Distinguish between rework and repair as defined by J-STD-001
• Describe the key procedures, rules, and documentation requirements for performing rework and repair on electronic assemblies
• Explain the requirements for cleaning and validating cleanliness after rework or repair

Final Exam
Participants must complete the Final Exam with a passing score of 80% to access and download their Introduction to J-STD-001 Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that participants must wait 24 hours after completing their second attempt to commence their third and final attempt.
 

This course is ideal for soldering operators, technicians, quality inspectors, process engineers, and production supervisors, this course requires no prior J-STD-001 experience—only a desire to improve solder joint integrity and compliance. If you choose materials, set up soldering processes, verify workmanship, or troubleshoot defects in electronic assemblies, you’ll gain the skills and shared vocabulary needed to achieve consistent, high-reliability soldering results.

Global Electronics Association offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online self-paced: Participants can access course materials on the Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines and monitor the progress of the participants who register for a course.