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Advanced Packaging: Introduction to Polymers introduces the types of polymers and polymer composites used in advanced packaging applications, package types, and trends in packaging architecture.
In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools. AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the concepts and show what is possible with current technologies.
In industries where precision and reliability are non-negotiable, from healthcare to automotive, aerospace, and beyond, the presence of counterfeit electronic components can spell disaster. Not only do these components have the potential to cause significant financial loss, but they also pose serious risks to safety and could be life-threatening.
Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.
A comprehensive overview of process control methodology including how to utilize the IPC-J-STD-001 Standard and its associated Handbook to consistently conform to acceptance criteria throughout the assembly process.
This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.
You’ll use IPC-A-610 to align quality expectations, reduce rework, satisfy customer requirements, and support reliable, high-quality production.
You’ll use J-STD-001 to make sound process decisions, align quality expectations across teams, reduce rework, and support consistent, high-reliability outcomes.
Master the essentials of PCB Fabrication for Operators with a course that guides you step-by-step
through each phase of the process. You’ll gain practical, in-depth knowledge about everything from
inner-layer fabrication and lamination to solder mask application, surface finishes, and final testing
In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality.
After completing this course, you will be able to:
Identify and correct control processes that negatively affect circuit board quality
Establish the root cause of potential defects to minimize and prevent loss of quality
Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating
Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes
Equip your team to quickly and effectively identify, analyze, and address PCBA production defects. Jim Hall and Phil Zarrow, the authors of Troubleshooting for Electronics Manufacturing and the acclaimed BoardTalk podcast, offer decades of practical insights that students can immediately use to increase reliability, yields, and cost savings.