Result
In this course, participants will learn how to identify and determine the value of the most common
electronic components used in PCB assembly, as well as how to use component markings and
assembly documentation to ensure their correct orientation and placement.
Présentez aux participants les causes des décharges électrostatiques et les mesures que vous pouvez prendre pour atténuer leurs effets lors de la manipulation, du stockage ou du transport de composants sensibles aux décharges électrostatiques dans une usine de fabrication. Ces mesures préventives et leur application sont basées sur ANSI/ESD S20.20 et d'autres normes pertinentes.
本课程向学员介绍电子制造中最常见的安全实践和工作场所危害。完成本课程后，学员将能够使用旨在确保您和您的同事在制造工厂内安全的关键工具、材料和流程。
能够运用关键工具、材料和工艺流程设计来预防和控制生产场所内的 ESD 影
响。
本课程向参与者介绍 FOD 的成因及在组装车间处理、储存或运输物品时减轻 FOD 影响您可以采
取的步骤。
Ce cours présente aux participants les causes des DOE, ainsi que les mesures que vous pouvez prendre pour atténuer leurs effets lors de la manipulation, du stockage ou du transport d’articles dans une usine de fabrication.
Engineers make decisions every day that impact manufacturing. Make sure it's a positive impact by introducing the key concepts, tools, materials, and processes critical for engineers to succeed in electronics assembly.
Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.
A comprehensive overview of process control methodology including how to utilize the IPC-J-STD-001 Standard and its associated Handbook to consistently conform to acceptance criteria throughout the assembly process.
This course introduces participants to the causes of ESD and the steps you can take to mitigate its effects when handling, storing or transporting ESD-sensitive components in a manufacturing facility. These preventive measures and their application are based on ANSI/ESD S20.20 and other relevant standards.
Stellen Sie den Teilnehmern die Ursachen von ESD und die Maßnahmen vor, die Sie ergreifen können, um ihre Auswirkungen bei der Handhabung, Lagerung oder dem Transport von ESD-empfindlichen Komponenten in einer Produktionsstätte zu mindern. Diese vorbeugenden Maßnahmen und ihre Anwendung basieren auf ANSI/ESD S20.20 und anderen relevanten Standards.
Dieser Kurs macht die Teilnehmer mit den Ursachen von Ablagerungen von Fremdpartikeln (FOD) und den Maßnahmen vertraut, die Sie ergreifen können, um die Auswirkungen von FOD bei der Handhabung, der Lagerung oder dem Transport von Gegenständen in einer Fertigungsstätte zu verringern.
This course introduces participants to the causes of Foreign Object Debris (FOD) and the steps you can take to mitigate its effects when handling, storing, or transporting items in a manufacturing facility. After completing this course, you will be able to employ the key tools, materials, and processes designed to prevent and control the effects of FOD within a manufacturing facility.
This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.
You’ll use IPC-A-610 to align quality expectations, reduce rework, satisfy customer requirements, and support reliable, high-quality production.
You’ll use J-STD-001 to make sound process decisions, align quality expectations across teams, reduce rework, and support consistent, high-reliability outcomes.
Identify the most common IPC standards used by electronics manufacturers, explain product classes and acceptability conditions as outlined in IPC standards, utilize IPC standards to precisely locate specific acceptance criteria, and use figures, illustrations, tables, and units of measurement to assess compliance.
Onboarding manufacturing engineers new to the electronics industry can be a daunting task. What if you had a self-paced course that provides a comprehensive overview of the roles and responsibilities of manufacturing engineers in our industry? IPC worked with industry subject-matter experts and instructional designers to create an introductory course that takes approximately 3-1/2 hours to complete. In addition to understanding the role, participants will also learn to use documentation control systems, product identification, and product traceability.
A comprehensive overview of the stencil printing process for a manufacturing engineer. Participants will learn how to select and store solder pastes & adhesives. They will also learn how to create and maintain stencils, the function of the stencil printer, as well as how to set up the stencil printer for a new product introduction, or NPI, run.
This course provides a comprehensive overview of the surface mount assembly process including information on component considerations, selecting and setting up pick and place machines, and the reflow process. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.
This course provides a comprehensive overview of component preparation, tool selection, manual component insertion, and automated component insertion in electronics assembly with through-hole components. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.
In this course, you will be able to set up, monitor, and maintain wave and selective soldering equipment to support consistent, high-quality production. You will know how to apply process parameters, interpret profile data, select the right nozzles and solder pot configuration, and implement maintenance procedures that reduce variation, prevent common defects, and keep your line running efficiently.
In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality.
After completing this course, you will be able to:
Identify and correct control processes that negatively affect circuit board quality
Establish the root cause of potential defects to minimize and prevent loss of quality
Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating
Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes
In electronics manufacturing, chemicals are everywhere, from cleaning agents to conformal coatings, and mishandling them can risk health, safety, and production. This course equips engineers with the skills to read, interpret, and apply Safety Data Sheets (SDS) to make informed decisions that keep people safe and processes compliant.
This course is ideal for operators, technicians, supervisory personnel and other staff members that must consistently and effectively employ the key tools, materials, and processes designed to keep workers safe within a manufacturing facility.
Ce cours présente aux participants les pratiques de sécurité et les risques professionnels les plus courants dans la fabrication de produits électroniques. Après avoir terminé ce cours, les participants seront en mesure d'utiliser les principaux outils, matériaux et processus conçus pour assurer votre sécurité et celle de vos collègues dans une usine de fabrication.
Dieser Kurs macht die Teilnehmer mit den häufigsten Sicherheitspraktiken und Gefahren am Arbeitsplatz in der Elektronikfertigung vertraut. Nach Abschluss dieses Kurses sind Sie in der Lage, die wichtigsten Instrumente, Materialien und Verfahren, die für Ihre eigene Sicherheit und die Ihrer Mitarbeiter in einer Produktionsanlage vorgesehen sind, einzusetzen.