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Advanced Packaging: Introduction to Polymers introduces the types of polymers and polymer composites used in advanced packaging applications, package types, and trends in packaging architecture.
This course focuses on BTC packaging and downstream manufacturing assembly, covering various BTC configurations such as QFN, LGA, MLF, SON, and DFN in both periphery-leaded and solder-ball array packages. By the end of this course, you’ll have the knowledge and practical insights needed to achieve high-yield production and build reliable BTC assemblies in today’s demanding electronics industry.
Taught by a process-driven PCB design engineer with more than 30 years of experience in the electronic and aerospace industry, this three-week program aims to improve the board designs from engineers of varying levels of proficiency and elevate your designs to be more precise and yield-worthy. The principles and methods you’ll learn here are essential for adapting to the specific requirements of all boards, including complex RF and mixed-type designs.
Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program covers the key business and technical concepts that program managers in the electronics industry need to turn customers into lifelong clients.
In industries where precision and reliability are non-negotiable, from healthcare to automotive, aerospace, and beyond, the presence of counterfeit electronic components can spell disaster. Not only do these components have the potential to cause significant financial loss, but they also pose serious risks to safety and could be life-threatening.
Gain essential skills to design and manufacture high-quality, compliant flexible and rigid-flex printed circuit boards. Led by IPC-certified expert Nick Koop, this interactive two-week course provides a balanced foundation of theory and practical application.
Taught by a certified industry expert with more than 25 years of experience in the field, this 6-week online program introduces participants to the concepts and skills required to create real-world designs that comply with IPC standards. This introductory course will focus on front-end design concepts such as schematic capture, library parts creation, basic electrical engineering concepts, and documentation.
In this course, participants employ the lessons learned in Introduction to PCB Design I to effectively implement their designs using techniques such as multi-layer routing, signal integrity, transmission lines, and more. The course also focuses on how manufacturing and assembly techniques impact design, documentation and manufacturing file generation.
Unleash the potential of wire harness design with our course led by IPC-certified expert Didem Üstün. This two-week intensive program transforms newcomers into skilled designers ready to tackle the complicated challenges of the modern wire harness industry.
In un settore altamente competitivo come quello dell'elettronica, le conoscenze e le competenze di chi progetta il layout del circuito stampato (PCB) e del suo assemblaggio (PBA) hanno un impatto diretto sul successo o sul fallimento del prodotto e incide sul time-to-market. Il corso online sui Fondamenti di PCB IPC è progettato per fornire le competenze necessarie per creare schemi che rispecchino accuratamente l’intento progettuale e la conformità agli standard IPC per la documentazione dello schema.
This course is designed to provide designers, assemblers, engineers, and management with a wide overview of PCBA and wire harness manufacturing processes and relevant standards used by industry. Upon completion, participants will be able to:
• Understand the structure and purpose of IPC standards in electronics manufacturing.
• Navigate the IPC standards library and specification tree.
• Identify IPC standards applicable to design, fabrication, assembly, and testing of PCBA and Wire Harnesses.
• Explore the standards covering processes and materials for PCB assembly and testing.
• Create awareness for special industry segments such as automotive and military standards.
This course introduces advanced PCB design techniques for next-gen applications. Topics include layout, routing, materials, manufacturing, and documentation, with a focus on Ultra HDI, 3D printed electronics, and optical transmission line structures. Learn to design high-performance, manufacturable PCBs for cutting-edge technologies.
This course is designed to provide the skills necessary to effectively implement designs requiring flex and rigid-flex circuits in accordance with product requirements. PCB Design for Flex & Rigid-Flex Boards also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
Taught by an industry expert with more than 40 years of experience in the field, this three-week online program is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.
This course addresses specific design challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. PCB Design for Military & Aerospace Applications also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
This course provides the theoretical knowledge and practical skills required to create IPC-compliant PCB designs for high-speed analog, radio (RF), and microwave frequencies. This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to:
Design boards for high-speed analog and RF/microwave frequencies.
Understand the trade-offs in materials used in these applications.
Define a board stackup that implements structures that will meet the needs of these designs.
Understand and mitigate signal integrity issues for these designs.
Understand and define the effects of mechanical retention needs for these applications.
Define and implement the tighter manufacturing tolerances needed for these designs.
Understand the use of mixed material stackups in these designs.
Understand the documentation requirements for these designs.
Equip yourself and your team with the knowledge and skills to design and layout PCBs that meet advanced signal integrity requirements, ensuring optimal performance in high-speed digital circuits.
Miniaturizing electronics while increasing circuit density and functionality requires advanced
packaging solutions. Among them, Package-on-Package (PoP) is widely used in Integrated Circuit (IC)
design. This course explores PoP packaging and its role in downstream manufacturing assembly,
focusing on high-yield production and product reliability.
Navigate the future of manufacturing design! Dive into the latest DFM trends, from evolving component technology to cutting-edge assembly processes. Master the art of modern manufacturing. Design smarter, today
This course aims to enhance product reliability and maintain high production yields by offering comprehensive insights into solder joint voids. We will explore the origins of these voids, understand their causes, and analyze their impacts on solder joint efficacy and overall product dependability.
Dive into the dynamic world of semiconductor chips with our expertly designed course, crafted for professionals who aim to master the industry's intricacies. From concept to creation, explore each stage of the semiconductor lifecycle — design, manufacturing, assembly, and testing.
Understand the foundational principles of electrical systems and electronic hardware. Topics include basic DC and AC electrical theory, passive and semiconductor components, the use of basic test tools, and familiarity with common methods of inspection.
The Train-the-Trainer course equips subject-matter experts (engineers, technicians, CITs/MITs) with the instructional knowledge, pedagogical and andragogical principles, and facilitation skills necessary to effectively teach operators, technicians, and engineers in electronics manufacturing.
The Transform Your Constraint Engineering PCB Designs course is developed to provide specific paths to understanding Electrical and Mechanical Models which allows the experienced PCB design engineer opportunities to generate specific routing features to help improve, develop, and advance their design skills into a robust engineering skill set.
Equip your team to quickly and effectively identify, analyze, and address PCBA production defects. Jim Hall and Phil Zarrow, the authors of Troubleshooting for Electronics Manufacturing and the acclaimed BoardTalk podcast, offer decades of practical insights that students can immediately use to increase reliability, yields, and cost savings.