Result
Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability.
The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies. To equip professionals with the necessary skills and process knowledge, IPC developed this course.
The course will start with design of HDI and advanced packaging concepts. This will be followed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. Next, concepts necessary for the design of wearable electronics and how the use of concepts from HDI and Embedded are necessary to achieve the small size and light weight of wearable electronics.