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Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability.
The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies. To equip professionals with the necessary skills and process knowledge, IPC developed this course.
Advanced Packaging: Introduction to Polymers introduces the types of polymers and polymer composites used in advanced packaging applications, package types, and trends in packaging architecture.
In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools. AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the concepts and show what is possible with current technologies.
Taught by a process-driven PCB design engineer with more than 30 years of experience in the electronic and aerospace industry, this three-week program aims to improve the board designs from engineers of varying levels of proficiency and elevate your designs to be more precise and yield-worthy. The principles and methods you’ll learn here are essential for adapting to the specific requirements of all boards, including complex RF and mixed-type designs.
Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program covers the key business and technical concepts that program managers in the electronics industry need to turn customers into lifelong clients.
In industries where precision and reliability are non-negotiable, from healthcare to automotive, aerospace, and beyond, the presence of counterfeit electronic components can spell disaster. Not only do these components have the potential to cause significant financial loss, but they also pose serious risks to safety and could be life-threatening.
In this course, participants employ the lessons learned in Introduction to PCB Design I to effectively implement their designs using techniques such as multi-layer routing, signal integrity, transmission lines, and more. The course also focuses on how manufacturing and assembly techniques impact design, documentation and manufacturing file generation.
In un settore altamente competitivo come quello dell'elettronica, le conoscenze e le competenze di chi progetta il layout del circuito stampato (PCB) e del suo assemblaggio (PBA) hanno un impatto diretto sul successo o sul fallimento del prodotto e incide sul time-to-market. Il corso IPC PCB Fundamentals II è pensato per fornire le competenze necessarie alla progettazione di PCB/PBA che rispecchi _ l'intento progettuale, partendo dalle regole di progettazione necessarie e nel rispetto degli standard IPC.
The course will start with design of HDI and advanced packaging concepts. This will be followed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. Next, concepts necessary for the design of wearable electronics and how the use of concepts from HDI and Embedded are necessary to achieve the small size and light weight of wearable electronics.
This course introduces advanced PCB design techniques for next-gen applications. Topics include layout, routing, materials, manufacturing, and documentation, with a focus on Ultra HDI, 3D printed electronics, and optical transmission line structures. Learn to design high-performance, manufacturable PCBs for cutting-edge technologies.
This course is designed to provide the skills necessary to effectively implement designs requiring flex and rigid-flex circuits in accordance with product requirements. PCB Design for Flex & Rigid-Flex Boards also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
Taught by an industry expert with more than 40 years of experience in the field, this three-week online program is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.
This course addresses specific design challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. PCB Design for Military & Aerospace Applications also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
This course provides the theoretical knowledge and practical skills required to create IPC-compliant PCB designs for high-speed analog, radio (RF), and microwave frequencies. This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to:
Design boards for high-speed analog and RF/microwave frequencies.
Understand the trade-offs in materials used in these applications.
Define a board stackup that implements structures that will meet the needs of these designs.
Understand and mitigate signal integrity issues for these designs.
Understand and define the effects of mechanical retention needs for these applications.
Define and implement the tighter manufacturing tolerances needed for these designs.
Understand the use of mixed material stackups in these designs.
Understand the documentation requirements for these designs.
Equip yourself and your team with the knowledge and skills to design and layout PCBs that meet advanced signal integrity requirements, ensuring optimal performance in high-speed digital circuits.
Navigate the future of manufacturing design! Dive into the latest DFM trends, from evolving component technology to cutting-edge assembly processes. Master the art of modern manufacturing. Design smarter, today
This course aims to enhance product reliability and maintain high production yields by offering comprehensive insights into solder joint voids. We will explore the origins of these voids, understand their causes, and analyze their impacts on solder joint efficacy and overall product dependability.
The Train-the-Trainer course equips subject-matter experts (engineers, technicians, CITs/MITs) with the instructional knowledge, pedagogical and andragogical principles, and facilitation skills necessary to effectively teach operators, technicians, and engineers in electronics manufacturing.
The Transform Your Constraint Engineering PCB Designs course is developed to provide specific paths to understanding Electrical and Mechanical Models which allows the experienced PCB design engineer opportunities to generate specific routing features to help improve, develop, and advance their design skills into a robust engineering skill set.
Equip your team to quickly and effectively identify, analyze, and address PCBA production defects. Jim Hall and Phil Zarrow, the authors of Troubleshooting for Electronics Manufacturing and the acclaimed BoardTalk podcast, offer decades of practical insights that students can immediately use to increase reliability, yields, and cost savings.