Result
Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability.
The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies. To equip professionals with the necessary skills and process knowledge, IPC developed this course.
In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools. AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the concepts and show what is possible with current technologies.
In un settore altamente competitivo come quello dell'elettronica, le conoscenze e le competenze di chi progetta il layout del circuito stampato (PCB) e del suo assemblaggio (PBA) hanno un impatto diretto sul successo o sul fallimento del prodotto e incide sul time-to-market. Il corso IPC PCB Fundamentals II è pensato per fornire le competenze necessarie alla progettazione di PCB/PBA che rispecchi _ l'intento progettuale, partendo dalle regole di progettazione necessarie e nel rispetto degli standard IPC.
The course will start with design of HDI and advanced packaging concepts. This will be followed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. Next, concepts necessary for the design of wearable electronics and how the use of concepts from HDI and Embedded are necessary to achieve the small size and light weight of wearable electronics.