Result
This course focuses on BTC packaging and downstream manufacturing assembly, covering various BTC configurations such as QFN, LGA, MLF, SON, and DFN in both periphery-leaded and solder-ball array packages. By the end of this course, you’ll have the knowledge and practical insights needed to achieve high-yield production and build reliable BTC assemblies in today’s demanding electronics industry.
Taught by a certified industry expert with more than 25 years of experience in the field, this 6-week online program introduces participants to the concepts and skills required to create real-world designs that comply with IPC standards. This introductory course will focus on front-end design concepts such as schematic capture, library parts creation, basic electrical engineering concepts, and documentation.
In un settore altamente competitivo come quello dell'elettronica, le conoscenze e le competenze di chi progetta il layout del circuito stampato (PCB) e del suo assemblaggio (PBA) hanno un impatto diretto sul successo o sul fallimento del prodotto e incide sul time-to-market. Il corso online sui Fondamenti di PCB IPC è progettato per fornire le competenze necessarie per creare schemi che rispecchino accuratamente l’intento progettuale e la conformità agli standard IPC per la documentazione dello schema.
This course is designed to provide designers, assemblers, engineers, and management with a wide overview of PCBA and wire harness manufacturing processes and relevant standards used by industry. Upon completion, participants will be able to:
• Understand the structure and purpose of IPC standards in electronics manufacturing.
• Navigate the IPC standards library and specification tree.
• Identify IPC standards applicable to design, fabrication, assembly, and testing of PCBA and Wire Harnesses.
• Explore the standards covering processes and materials for PCB assembly and testing.
• Create awareness for special industry segments such as automotive and military standards.
Miniaturizing electronics while increasing circuit density and functionality requires advanced
packaging solutions. Among them, Package-on-Package (PoP) is widely used in Integrated Circuit (IC)
design. This course explores PoP packaging and its role in downstream manufacturing assembly,
focusing on high-yield production and product reliability.