Result
Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability.
The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies. To equip professionals with the necessary skills and process knowledge, IPC developed this course.
The course will start with design of HDI and advanced packaging concepts. This will be followed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. Next, concepts necessary for the design of wearable electronics and how the use of concepts from HDI and Embedded are necessary to achieve the small size and light weight of wearable electronics.
This course is designed to provide the skills necessary to effectively implement designs requiring flex and rigid-flex circuits in accordance with product requirements. PCB Design for Flex & Rigid-Flex Boards also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
This course addresses specific design challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. PCB Design for Military & Aerospace Applications also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
This course provides the theoretical knowledge and practical skills required to create IPC-compliant PCB designs for high-speed analog, radio (RF), and microwave frequencies. This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to:
Design boards for high-speed analog and RF/microwave frequencies.
Understand the trade-offs in materials used in these applications.
Define a board stackup that implements structures that will meet the needs of these designs.
Understand and mitigate signal integrity issues for these designs.
Understand and define the effects of mechanical retention needs for these applications.
Define and implement the tighter manufacturing tolerances needed for these designs.
Understand the use of mixed material stackups in these designs.
Understand the documentation requirements for these designs.
Equip yourself and your team with the knowledge and skills to design and layout PCBs that meet advanced signal integrity requirements, ensuring optimal performance in high-speed digital circuits.