Result
In this course, participants will learn how to identify and determine the value of the most common
electronic components used in PCB assembly, as well as how to use component markings and
assembly documentation to ensure their correct orientation and placement.
This course introduces participants to the causes of ESD and the steps you can take to mitigate its effects when handling, storing or transporting ESD-sensitive components in a manufacturing facility. These preventive measures and their application are based on ANSI/ESD S20.20 and other relevant standards.
This course introduces participants to the causes of Foreign Object Debris (FOD) and the steps you can take to mitigate its effects when handling, storing, or transporting items in a manufacturing facility. After completing this course, you will be able to employ the key tools, materials, and processes designed to prevent and control the effects of FOD within a manufacturing facility.
This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.
You’ll use IPC-A-610 to align quality expectations, reduce rework, satisfy customer requirements, and support reliable, high-quality production.
You’ll use J-STD-001 to make sound process decisions, align quality expectations across teams, reduce rework, and support consistent, high-reliability outcomes.
Identify the most common IPC standards used by electronics manufacturers, explain product classes and acceptability conditions as outlined in IPC standards, utilize IPC standards to precisely locate specific acceptance criteria, and use figures, illustrations, tables, and units of measurement to assess compliance.
In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality.
After completing this course, you will be able to:
Identify and correct control processes that negatively affect circuit board quality
Establish the root cause of potential defects to minimize and prevent loss of quality
Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating
Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes
In electronics manufacturing, chemicals are everywhere, from cleaning agents to conformal coatings, and mishandling them can risk health, safety, and production. This course equips engineers with the skills to read, interpret, and apply Safety Data Sheets (SDS) to make informed decisions that keep people safe and processes compliant.
This course is ideal for operators, technicians, supervisory personnel and other staff members that must consistently and effectively employ the key tools, materials, and processes designed to keep workers safe within a manufacturing facility.