Advanced Packaging: HDI Enabling Technology

In today's rapidly evolving technological landscape, the demand for smaller and more powerful electronic devices continues to grow. From smartphones to tablets, the drive for miniaturization is evident. However, there are underlying factors that contribute to this trend, which may not be immediately apparent.

Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability. The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies. 

Member Price
$470.00
Nonmember Price
$630.00
Access
90 Days From Enrollment

  • Course Level: Advanced

  • Training Time

    2 weeks (4 two-hour online instructor-led sessions)

  • Certificate of Completion

    Certificate of Completion

  • Seasonal Enrollment

    Access for 90 Days

Questions

Need to know more? Send us your questions and we'll get you an answer.

Download the syllabus

Week 1 session 1 topics include:

  • Why use HDI/UHDI
  • HDI designs
  • Sequential lamination
  • Electrical Performance and Signal Integrity
  • Materials/Glass Styles/Non-reinforced
    • Dielectric films
    • Unclad material
  • Test Vehicles
  • HDI/Ultra HDI roadmaps

Week 1 session 2 topics include:

  • Via formation
    • CO2
    • UV-YAG
    • Mechanical
  • Surface preparation/lamination
  • Copper foil types
  • Metallization
    • Conventional
    • Other methods
    • Semi-additive and modified Semi-Additive Processing (mSAP)

Week 2 session 3 topics include:

  • Metallization (continued)
    • Direct metallization
      • Carbon
      • Conductive polymer
      • Palladium
  • Other methods
  • Imaging Technology
    • LDI
    • LED
    • Conventional UV with phototool
  • Fine Line Etching
    • Chemical parameters
    • Equipment considerations

Week 2 session 4 topics include:

  • Via Fill technology
    • Paste fill (polymer)
      • Fill parameters
      • Material properties
      • How to apply plugging paste
      • Issues/concerns
      • Defects
    • Copper plating fill
      • Chemical parameters
      • Plating cell design/equipment
      • Issues/concerns
      • Defects
    • Copper wrap requirements
  • Reliability & Acceptability
    • Microvia Interfacial Fractures
    • Thermal and Mechanical Shock Failures
  • Test Methods
    • OM (D-coupons)
    • IST
    • CITC
    • Week 1Air-to-Air
       

This course is perfect fo PCB fabricators and end users that require an understanding of the constraints with respect to blind and filled vias, fine-pitch designs, material and foil types, stack-ups and reliability.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.

Mike Carano headshot

Mike brings over 40 years of electronics industry experience with special expertise in manufacturing, performance chemicals, metals, semiconductors, medical devices, and advanced packaging.  

A recognized thought leader, subject matter expert (SME), and author, Mike holds 7 US and 20 foreign patents. He has published over 190 articles and presented peered reviewed technical papers all over the world. 

Mike has served on more than 20 IPC Standards committees and has served 14 years as a member of the IPC Board of Directors. Mike has developed multiple professional development courses for IPC including the Advanced Trouble Shooting and Defect Analysis for Printed Circuit Boards.

In 2014 Mike was elected to the IPC Raymond E. Pritchard Hall of Fame, and later recognized for his standards work with Mike’s awarding of the Dieter Bergman Fellowship award and most recently the ANSI Finegan Medal. Previously Mike was the VP of Technology Business Development at RBP Chemical Technology, and the Global Director of R&D and Applications Engineering for the OM Group.  He holds a B.A. in Chemistry and an M.B.A.

 

Other Courses