PoP Packaging & Assembly: Materials, Processes, Reliability

Miniaturizing electronics while increasing circuit density and functionality requires advanced
packaging solutions. Among them, Package-on-Package (PoP) is widely used in Integrated Circuit (IC)
design. This course explores PoP packaging and its role in downstream manufacturing assembly,
focusing on high-yield production and product reliability.

Combining real-world applications with fundamental manufacturing principles, this course is
designed for all who are involved with or interested in PoP and BGA assembly. Key topics include
materials, techniques, processes, and reliability considerations for both lead-free and tin-lead
products. Participants will also examine the similarities and differences between PoPs and BGAs,
including co-planarity, thermal stability of molding materials, and conformal coating applications.
The course covers best practices for PoP assembly, including solder material properties, PCB
assembly processes, and rework strategies. It also addresses real-world production challenges,
particularly PoP solder joint reliability for both upper and lower packages, and the factors that
contribute to strong, reliable solder joints.

Led by an International Hall of Famer of Women in Technology—an industry expert and author of
groundbreaking, globally recognized books on lead-free technology, electronics manufacturing, and
reliability—this course delivers deep, hands-on knowledge. With experience solving some of the
industry’s toughest reliability and production challenges, the instructor provides insights applicable
to both commercial and military applications.