Ensuring Excellence: IPC-A-610 Process Optimization

Learning Objectives

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Module 1: Introduction

• Define the purpose of the IPC-HDBK-610 and IPC-A-610
• Use cross-reference tables in the IPC-HDBK-610 to locate content in IPC-A-610
• Use product classes and acceptability designators in real-world scenarios
• Define and explain acceptability categories and their functions.
• Use inspection criteria and methodologies to evaluate assemblies 

Module 2:  Electrostatic Discharge

• Explain ESD and its impact on sensitive electronic components
• Differentiate between ESD and electrical overstress (EOS)
• Recognize ESD Sensitivity and Sources
• Describe an ESD-safe workstation
• Formulate and implement an ESD control plan
• Apply ESD Prevention Techniques
• Ensure Proper Handling of ESD-Sensitive Items
• Evaluate and Monitor ESD Safety Measures

Module 3: Mechanical Assembly

• Identify the criteria used to evaluate mechanical assembly
• Define minimum electrical clearance
• Identify the cause of interference in fitting mechanical hardware
• Explain the requirements for mounting high power components
• Define the requirements for mounting heatsinks
• Detail the characteristics of threaded hardware
• Define torque and its impact on assembly
• Identify connector pins and their role in assembly

Module 4: Soldering

• Define the criteria for acceptable solder joint quality
• Identify and explain various soldering methods
• Evaluate solder joint anomalies
• Explain the impact of material solderability on solder joint quality
• Assess solder connections for acceptability based on visual inspection criteria
• Identify the causes and preventive measures for common soldering defects

Module 5: Through-Hole Technology

• Explain the acceptability criteria for forming, mounting, securing, and soldering TH components
• Recognize and discern the implications of common through-hole technology anomalies
• Identify common causes of through-hole technology defects
• Determine corrective actions and process improvements to comply with IPC-A-610 acceptability requirements

Module 6: Surface Mount Assemblies

• Identify the acceptability criteria for surface mount technology (SMT) components
• Identify common SMT process anomalies
• Identify common causes of SMT defects
• Identify common SMT terminations and explain their impact on the SMT assembly process
• Evaluate process controls and environmental factors that impact SMT assembly quality
• Implement measures to mitigate and prevent common SMT defects
• Describe alternative SMT mounting practices

Module 7:  Component Damage

• Identify the different types of component damage and their consequences
• Identify common causes of component damage
• Use IPC-A-610 to determine if component damage qualifies as a defect
• Implement measures to prevent component damage
• Inspect and maintain tools and equipment

Module 8: Printed Boards and Assemblies

• Identify common printed circuit board (PCB) and assembly (PCBA) anomalies
• Use IPC-A-610 to determine the acceptability of common PCB and PCBA anomalies
• Explain the implications of PCB and PCBA defects
• Determine the common causes of PCB and PCBA defects
• Implement steps to resolve common causes of PCB and PCBA defects

Module 9: High Voltage

• Explain the importance of IPC-A-610 criteria for high voltage applications
• Identify high-voltage solder joint requirements
• Identify methods to minimize common high-voltage defects
• Demonstrate ball soldering techniques for through-hole and wire terminal connections
• Identify types of flux suitable for high-voltage assemblies
• Identify appropriate cleaning methods to prevent flux residue
• Evaluate solder alloys for high-voltage applications
• Define acceptable insulation clearance for wires in high-voltage applications
• Define methods to prevent insulation damage
• Ensure compliance with maximum component height clearance

Module 10: Jumper Wires

• Define the requirements for selecting and insulating jumper wires
• Describe and implement best practices for routing jumper wires
• Explain the importance of staking jumper wires for Class 2 and 3 products
• Apply staking techniques using adhesive or tape to secure wires effectively
• Demonstrate correct soldering techniques for jumper wires
• Identify common jumper wire anomalies and their consequences
• Develop and follow guidelines to avoid common defects in jumper wire installations

FINAL EXAM

Participants must complete the Final Exam with a passing score of 80% to access and download their Ensuring Excellence: IPC-A-610 Process Optimization Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.

This course is ideal for technicians and engineers responsible for developing, implementing, and enhancing assembly processes to ensure consistent conformance to acceptance criteria.

Global Electronics Association offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online self-paced: Participants can access course materials on the Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.