BTC Packaging & Assembly: Materials, Processes, Reliability

As the demand for electronics miniaturization and higher circuit density grows, Bottom-Termination Components (BTCs) have become essential in modern Integrated Circuit (IC) packaging. This course focuses on BTC packaging and downstream manufacturing assembly, covering various BTC configurations such as QFN, LGA, MLF, SON, and DFN in both periphery-leaded and solder-ball array packages.
This course is designed for anyone involved in BTC assembly or seeking a comprehensive understanding of its impact on electronics manufacturing. Through it, you will explore best practices for BTC assembly, including:
•    Solder material properties and their impact on joint reliability
•    PCB assembly processes optimized for BTCs
•    Common production challenges and real-world solutions
•    BTC solder joint reliability for both lead-free and tin-lead products
•    Strategies for ensuring robust BTC solder interconnections
This course is led by an International Hall of Famer of Women in Technology who has authored several globally recognized books on lead-free technology, electronics manufacturing, and reliability. With a proven track record of solving some of the industry's toughest reliability and production challenges, your instructor brings deep expertise through hands-on experience and advisory roles in both commercial and military applications.
By the end of this course, you’ll have the knowledge and practical insights needed to achieve high-yield production and build reliable BTC assemblies in today’s demanding electronics industry.
 

Member Price
$300.00
Nonmember Price
$350.00
Access
12 Months From Enrollment
Class Schedule

  • Course Level: Introductory

  • Training Time

    1 week (2 two-hour online instructor-led sessions)

  • Certificate of Completion

    Certificate of Completion

  • Enrollment

    Access for 12 Months

Questions

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Download Syllabus

Focusing on BTC assembly in materials, processes, and reliability, the course is mapped out to balance real-world hands-on practice and the engineering fundamentals behind the sound practice. 

Topics include:
•    Overall package evolution: Semiconductor to packages 
•    BTC: Drivers, challenges, types, substrates
•    Assembling: Performing solder paste, critical characteristics
•    Solder paste printing: Desired performance, process parameters, stencil design for thermal pad, squeegee properties
•    Assembling: PCB land design, component placement
•    Reflow techniques: Optimal profile, best practice
•    BTC rework: Key steps
•    Effects of surface finish on BTC assembly
•    Relative solderability of surface finishes
•    Study: Effects of surface finish ENIG vs Cu (Ni thickness)
•    Study: Effects of surface Finish ENEPIG (Pd thickness)
•    Effects of bare PCB
•    BTC solder joint reliability: Fundamentals, factors
•    Case Studies: MLF/LGA vs. BGA; CSP/QFN vs. BGA; QFN vs. TSOP
•    BTC solder joint reliability: Effects of surface finish
•    BTC solder joint reliability: Fillet, package design, land size, board thickness, underfill
•    LGA reliability challenges
•    BTC voids: Thermal pad, solder joint
•    BTC prevalent production defects: Prevention, remedies
•    Concluding remarks

ASSIGNMENT: 
Participants to bring further questions and issues for discussion
 

This course is designed for anyone involved in BTC assembly or seeking a comprehensive understanding of its impact on electronics manufacturing. 

Global Electronics Association offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their course dashboard.

Completion of the program with a score of 70% or higher on the final exam and/or final project is required to earn a certificate of completion and and 24 Professional Development Hours (PDHs)

Review IPC Workforce Training policies and procedures documents including the grievance and appeal forms.