Introduction to PCB Design for Manufacturability (Micromodules)

This series of ten micro-modules introduces some of the key concepts required to optimize the design of printed circuit boards for manufacture. If you'd like to learn more after completing the series, consider taking the IPC Design for Manufacturability course.

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3 Monate From Enrollment

  • Course Level: Introductory

  • Training Time

    10 Minutes Each

  • Certificate of Completion

  • Continuous Enrollment

    Access for 3 Monate

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Download the syllabus

MODULE 1: INTRODUCTION

  • What is Design for Manufacturing?
  • Why is Design for Manufacturing important?
  • Design & data flow
  • Why do design data packages have issues?


MODULE 2: PCB FABRICATOR CAPABILITY

  • What are the major PCB cost factors?
  • How does the design impact the cost?
  • How does PCB technology relate to plant capability?
  • Fabricator capability design rules
  • Supplier business model selection


MODULE 3: PCB MATERIAL SELECTION AND STACKUP SELECTION

  • What are the primary materials used to make a rigid PCB?
  • What are the primary materials used to make a flexible PCB?
  • Additional materials
  • What are key factors in determining the correct materials?


MODULE 4: CONDUCTIVE FEATURES

  • Function & design rules for PCB conductors
    • Dimensional characteristics
    • Physical properties


MODULE 5: DRILLED HOLES AND SLOTS

  • Plated hole types
  • Non-plated hole types
  • Slot formation
  • Hole feature size and quality
  • Key design for manufacturing issues
    • Hole reliability
    • Routing density
    • Overall quality


MODULE 6: MECHANICAL FEATURES

  • Mechanical Features
    • Depaneling
    • Routing
    • V/cut scoring
    • Punching
  • Special mechanical features
    • Countersinks and counter board holes
    • Milling
    • Beveling
  • Locational tolerances
  • DFM Issues related to mechanical features and tolerances


MODULE 7: MASK AND INKS

  • Why are solder masks and inks important?
  • Solder mask selection
  • Legend ink
  • DFM issues related to solder mask and legend


MODULE 8: IMPEDANCE AND SIGNAL LOSS

  • Impedance control
    • Resin content
    • Frequency
    • Test method
  • Signal loss control
    • Surface roughness
    • Material control
    • Via back-drilling
    • Line width adjustments
  • Stackup issues


MODULE 9: FLEXIBLE AND RIGID-FLEX PCBS

  • Composition of flexible PBCs
  • DFM questions related to flexible PBCs
  • Composition of rigid-flex PCBs
  • DFM questions related to rigid-flex PCBs
  • Collaborating with suppliers

MODULE 10: DOCUMENTATION QUALITY

  • Elements of a data package
  • Technical queries
  • Graphical data issues
  • Document package issues
  • The perfect data package

 

This series of modules is ideal for engineers, technicians, and other individuals who are new to Dfm and want to familiarize themselves with the key concepts involved in optimizing the design of PCBs for ease of manufacture. 

Global Electronics Association offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online self-paced: Participants can access course materials on the Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.